PATENTS
Surface Mount Semiconductor Package Formed by
Post-processing of Standard Through-hole Tab-mount Discrete Ssemiconductor
Devices
Thermally Conductive Thermoplastic
Mold Compount for Semiconductor Device Encapsulation and
Manufacture
Power Semiconductor Diode with
Integral Heatsinkng Leads Optimized for Isothermal Gradients Across the Surface
of the Die
Surface Mount Power Diode Package
with Molded-in Heatsink Fins
Semiconductor
Die Passibation Process